Challenges in etch of advanced materials
Metal gate (including dual metal gate) etch
High-k etch
Phase Change Memories etch
Copper and self-aligned barrier etch
Low-k etch
Plasma-resist interactions (trimming, hardening etc.)
New architecture and approaches
FinFETs, 3D gates, MugFETs etc.
Etch for strained Si
Double patterning for high density structures
Etch in micro- and nanoelectromechanics
Plasma modeling/simulations
Etch/strip plasmas
Plasma-surface interactions
Etch process control
Chamber contamination control
Chamber-to-chamber matching
In-situ measurements (temperature, ellipsometry, XPS etc.)
Pattern-focused metrology (material characterization of patterned
structures, line width roughness, scatterometry etc.)
Post etch processing (strip/clean)
Dry/wet Strip
Residue characterization
Post-etch cleaning
Pore sealing of low-k dielectrics
